MYCOM
CORPORATION
S | Processor brand: Sempron | |
M | Market segment: Mobile | |
S | Thermal design power: 25 Watt | |
3500 | Frequency / Model number:
| |
H | Package type: 638-pin lidless micro-PGA (Socket S1) | |
A | Voltage: Variable | |
X | Maximum die temperature: 95°C | |
4 | L2 cache: 512 KB | |
CM | Core revision: Stepping F2, 0.09 micron, socket S1 | |
Lifecycle support: Standard |
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